Engineered with cutting-edge MEMS technology, our probe card delivers unparalleled precision and efficiency for wafer testing, ideal for high parallelism and fine-pitch requirements.
ARES
Functional Probe Card
ARES
DDI
LCD Driver IC Test
Probe Card
Ultra-small pitch and high-frequency probing for AI pad, Au bump, TAB, and COF technologies at chip probe (CP) or final test (FT).
Engineered with cutting-edge MEMS technology, our probe card delivers unparalleled precision and efficiency for wafer testing, ideal for high parallelism and fine-pitch requirements.
Support frequencies up to 40GHz and accommodate bump pitches down to 80µm and pad pitches to 50µm. Perfect for high-frequency and fine-pitch applications.
Engineered with advanced MEMS technology, supports fine pitch and high-speed testing, operates at frequencies up to 40GHz, with a min. pitch of 65µm and pad sizes of 40µm.
Engineered with cutting-edge MEMS technology, our probe card delivers unparalleled precision and efficiency for wafer testing, ideal for high parallelism and fine-pitch requirements.
GAMMA-C
VPC
Verical Cobra
Probe Card
Engineered for optimal contact force management and exceptional planarity, supporting high pin counts during wafer testing.
Advanced adhesive ensures precise electrical connections with its unique conductive particle alignment technology. Ideal for high-density and fine-pitch assemblies.
