Dive into a world where innovation meets efficiency!
Our advanced probe cards are designed for RF, foundry, memory and logic devices, ensuring lower production costs and paving the way for chip probing technologies.
Engineered with cutting-edge MEMS technology, our probe card delivers unparalleled precision and efficiency for wafer testing, ideal for high parallelism and fine-pitch requirements.
ARES
Functional Porbe Card
ARES
DDI
LCD Driver IC Test
Probe Card
Ultra-small pitch and high-frequency probing for AI pad, Au bump, TAB, and COF technologies at chip probe (CP) or final test (FT).
Engineered with cutting-edge MEMS technology, our probe card delivers unparalleled precision and efficiency for wafer testing, ideal for high parallelism and fine-pitch requirements.
Engineered with cutting-edge MEMS technology, our probe card delivers unparalleled precision and efficiency for wafer testing, ideal for high parallelism and fine-pitch requirements.
GAMMA-C
VPC
Verical Cobra
Probe Card
Engineered for optimal contact force management and exceptional planarity, supporting high pin counts during wafer testing.
Advanced adhesive ensures precise electrical connections with its unique conductive particle alignment technology. Ideal for high-density and fine-pitch assemblies.
